Baya Systems and Aion Silicon Partner to Accelerate SoC and Chiplet Development

Baya Systems, a pioneer in software-driven, chiplet-ready semiconductor fabric IP for scalable AI, high-performance computing (HPC), and automotive applications, today announced a partnership with Aion Silicon (formerly Sondrel), a leading ASIC and SoC architecture and design services company. Together, the companies are delivering a joint solution that enables faster definition, design,...

24 Feb 2026 | Tuesday | NEWS
SPIE and Cadence Design Systems, Inc. Establish Ya-Chieh Lai Memorial Scholarship

SPIE, the international society of optics and photonics, Cadence Design Systems, Inc., and the Cadence Giving Foundation have partnered to jointly fund the Ya-Chieh Lai Memorial Scholarship. Starting in 2027 and spanning five years, the annual $10,000 scholarship will be awarded to a university student during the SPIE Design Technology Co-Optimization (DTCO) conference at ...

23 Feb 2026 | Monday | NEWS
SEMIFIVE Wins U.S. Design Contract for FHE Hardware Accelerator

SEMIFIVE, a leading global provider of custom AI semiconductor (ASIC) solutions, announced that it has secured a design win from Niobium, a U.S.-based leader in Fully Homomorphic Encryption (FHE) hardware acceleration platforms. This partnership represents a strategic milestone in SEMIFIVE's expansion in the U.S. market. The contract, valued at around KRW 10 billion (USD 6.86 million), covers the...

23 Feb 2026 | Monday | NEWS
Chiplet Summit Announces 2026 Best of Show Winners Highlighting Packaging and Connectivity Innovation

The fourth annual Chiplet Summit, the largest conference dedicated to chiplets, reported on its 2026 Best of Show Awards at the Santa Clara Convention Center. The winners are: Siemens EDA for “Packaging: Design” – Their Innovator3D IC software enables fast planning and heterogeneous integration of ASICs and chiplets using 2.5D and 3D packaging technologies. UCIe Consort...

20 Feb 2026 | Friday | NEWS
Renesas Electronics Corporation Develops Next-Gen Automotive SoC Platform for Software-Defined Vehicles

Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, has developed three System-on-Chip (SoC) technologies for automotive multi-domain electronic control units (ECUs). They feature advanced AI processing capabilities and chiplet functions, serving as the core technology platform for next-generation automotive electrical/electronic (E/E) architectures....

20 Feb 2026 | Friday | NEWS
SkyWater Technology Appoints Christine Dunbar to Lead Sales and Drive Foundry Expansion

SkyWater Technology (NASDAQ: SKYT), the largest exclusively U.S.-based pure-play semiconductor foundry, announced the appointment of Christine Dunbar as senior vice president of sales and solutions engineering, reporting directly to President and COO John Sakamoto. In her role, Dunbar will focus on accelerating customer acquisition and scaling growth across the company’s core platforms....

17 Feb 2026 | Tuesday | NEWS
ChEmpower Launches Chakra™ Abrasive-Free Polishing Pads for Advanced Chips

ChEmpower, a leader in semiconductor process innovation, announced Chakra™, a family of functional polishing pads, beginning with the Copper Series, designed specifically for abrasive-free Chemical Mechanical Planarization (CMP). Chakra™ is a core component of ChEmpower’s patented planarization technology, enabling the precision, yield, and surface integrity required for next-gen...

13 Feb 2026 | Friday | NEWS
VORAGO and wolfSSL Partner to Secure the Next Generation of Satellites

At SmallSat Symposium 2026, VORAGO Technologies, a radiation-hardened and radiation-tolerant chip provider for space applications, announced a software partnership with wolfSSL, a company specialising in embedded cryptography for secure systems, successfully for the last 20 years. This unique partnership delivers radiation-hardened chips with built-in, standards-based cryptographic secur...

13 Feb 2026 | Friday | NEWS
I/ONX Joins UNLV Program to Support Semiconductor Education

I/ONX High Performance Compute (HPC) has been selected to participate in a series of classes and training workshops at the University of Nevada, Las Vegas’ (UNLV) College of Engineering. I/ONX has joined the AI-driven, Career Inspiring Experiential Program for Semiconductor Education (ACIES) program as an industry partner, and Chief Executive Officer Justyn Hornor is leading the discussions...

13 Feb 2026 | Friday | NEWS
Wolfspeed Expands AI Use to Boost Manufacturing Efficiency

Wolfspeed, a global leader in silicon carbide technology, is expanding its use of Snowflake to accelerate manufacturing efficiency and operational excellence as it scales production to meet growing market demand. After bringing together factory, supply chain, and enterprise data on a single, governed platform, Wolfspeed is now deploying AI across its operations to improve cost, quality, ...

12 Feb 2026 | Thursday | NEWS
Keysight Launches SOS Enterprise for Better Engineering Data Control

Keysight Technologies, Inc. (NYSE: KEYS) announced SOS Enterprise, an advanced edition of its engineering data management platform. The solution builds on the SOS Core software and automates engineering data governance and traceability to prepare for AI adoption at scale. As semiconductor and electronics development accelerates, engineers face growing design complexity and rapidly incre...

12 Feb 2026 | Thursday | NEWS
Efinix Promotes Tony Ngai to Co-President and CTO

Efinix®, Inc., the FPGA pioneer accelerating edge AI innovation, announced the promotion of Tony Ngai to Co-President and Chief Technology Officer. In his expanded role, Ngai will drive the scaling of Efinix's engineering organisations while continuing to lead innovation in FPGA architecture, IC design, software development, and next-generation product roadmaps. "Tony invented Efinix’s ...

12 Feb 2026 | Thursday | NEWS
Cadence Launches ChipStack™ AI Super Agent for Chip Design

Cadence (Nasdaq: CDNS) announced a transformative step forward in redefining how semiconductors are designed with the launch of the ChipStack™ AI Super Agent—an agentic AI solution for front-end silicon design and verification. The Cadence® ChipStack AI Super Agent is the world’s first agentic workflow for automating chip design and verification. It provides up to 1...

11 Feb 2026 | Wednesday | NEWS
Arrow Electronics Launches E/E Architecture Initiative for Next-Generation Vehicles

Arrow Electronics (NYSE:ARW) has launched a strategic initiative and research hub to support next-generation vehicle electrical and electronic (E/E) architecture. The available resources provide automotive manufacturers and tier-1 suppliers with the engineering expertise and supply chain stability required to navigate the industry’s shift toward software-defined vehicles. As consumer and c...

11 Feb 2026 | Wednesday | NEWS
Mouser Electronics Named 2025 Americas Distributor of the Year by GCT

Mouser Electronics, Inc., the authorised global distributor with the newest electronic components and industrial automation products, has been awarded the 2025 Americas Distributor of the Year by GCT, a leading manufacturer of innovative electronic interconnect solutions. The award was recently presented to Mouser during a meeting between the two companies at Mouser Electronics Headquarters i...

11 Feb 2026 | Wednesday | NEWS
Growth Trends in Semiconductor Plant Construction

The construction market for semiconductor manufacturing facilities is expected to experience strong growth in the coming years, driven by rapid technological progress and rising global demand for chip production. Increased investment from both governments and private organisations is playing a key role in accelerating the development of new fabrication plants worldwide. Industry forecasts suggest...

9 Feb 2026 | Monday | NEWS
Semiconductor Devices Selects Eyelit to Optimise Manufacturing Operations

Eyelit Technologies (Eyelit), a leader in optimised planning, scheduling, and execution systems for manufacturers, announced that Semiconductor Devices (SCD), a rapidly growing semiconductor company, has selected Eyelit to enhance operational efficiency, production orchestration, and automation across its manufacturing operations. SCD’s selection of Eyelit enables a broader s...

6 Feb 2026 | Friday | NEWS
Silicon Quantum Computing Launches Quantum Twins

Silicon Quantum Computing ("SQC"), a leader in quantum computing and quantum machine learning, announced the launch of Quantum Twins, an application-specific quantum simulator designed to accelerate molecule and materials discovery. Built utilising the company's atomic-scale semiconductor manufacturing process, Quantum Twins showcases the exceptional precision and already-achieved s...

6 Feb 2026 | Friday | NEWS
Siemens Acquires Canopus AI

Siemens announced the acquisition of Canopus AI, an innovator in computational and AI-driven metrology solutions, enabling semiconductor manufacturers to achieve new levels of precision and efficiency in wafer and mask inspection processes. This acquisition strengthens Siemens' position in the semiconductor manufacturing ecosystem and expands its semiconductor design and manufacturing digital thre...

6 Feb 2026 | Friday | NEWS
THine Announces Optical DSP-Free Chipset for PCIe6 and PCIe7

THine Electronics, Inc. (Tokyo Stock Exchange:6769, “THine”), a global leading fabless semiconductor supplier of innovative mixed signal LSI and analog technologies as well as valuable AI/IoT-based solutions and AI/data servers, announced its optical DSP(digital signal processor)-free chipset with its ZERO EYE SKEW® technology for short-reach optical interconnect of PCI Expres...

5 Feb 2026 | Thursday | NEWS