In the spring of 2021, the Baoshan Second Reservoir in Hsinchu County stopped looking like a reservoir. Photographs from that April show a cracked brown basin with a thin channel of water at the bottom and a shoreline of dried mud. Taiwan had gone a full year without a typhoon making landfall, the first time since 1964, and storage in the reservoir fell to around seven percent of capacity. Baosha...
Alexander Simin, COO of POLYN Technology, speaks exclusively with Semicon Leaders Asia about the company's partnership with ALTER TECHNOLOGY France, the commercialisation of its neuromorphic AI technology, and its vision for advancing edge AI, automotive innovation and the future of Physical AI. Q1. How does this partnership with ALTER TECHNOLOGY France strengthen POLYN’s commercial...
In this exclusive interview with Semicon Leaders Asia, Frédéric Dupont, Chief Executive Officer of AlpSemi, discusses how the company's next-generation semiconductor power switches are enabling the widespread adoption of solid-state circuit breakers (SSCBs) for AI data centres, smart buildings, industrial electrification, and electric vehicles, paving the...
In this exclusive interview with Semicon Leaders Asia, Shekhar Kapoor, Executive Director of Product Line Management, Synopsys, shares how AI-driven design automation, advanced-node collaboration, and system-level optimisation are shaping the future of semiconductor innovation. Q. As AI, multi-die architectures, and advanced process nodes increase desig...
In this interview with Semicon Leaders Asia, Tim Allemeersch, Senior Director of Customer Success at Qualinx, explains how Qualinx is combining ultra-low-power GNSS technology with Galileo OSNMA to bring trusted positioning to mass-market connected devices. He highlights the importance of collaboration across the Galileo ecosystem, secure semiconductor manufacturing, and next-generation positionin...
In this interview with Semicon Leaders Asia, Chuck Xu, President, Interconnect Solutions at Qnity, shares how advanced packaging materials are becoming a critical enabler of AI-driven semiconductor innovation. He explains how Qnity is working closely with foundries, OSATs, substrate manufacturers, and equipment partners to accelerate the adoption of organic interposers, glass-cor...
In this interview with Semicon Leaders Asia, Jennifer Chen, Product Line Manager for Air Bearings and Precision Motion Systems at PI USA, shares insights into the future of precision positioning technologies and intelligent motion control. She explains how PI’s V-783 platform leverages advanced motion control, nanometre-resolution feedback systems, and high-performa...
ISC--Dell Technologies (NYSE: DELL) introduces the Dell PowerEdge XE8812 server, a new addition to the Dell AI Factory with NVIDIA, purpose-built for the world's most demanding HPC and AI workloads, featuring NVIDIA Vera Rubin NVL4 architecture and delivering up to 144 GPUs per rack. The announcement comes as Dell AI Factory deployments accelerate worldwide, advancing sovereign AI initiatives...
In this interview with Semicon Leaders Asia, Xinliang (XL) Wang, Senior Director, Product Portfolio Management at pSemi, explains how pSemi is expanding its RF technology portfolio to support increasingly complex wireless and connectivity ecosystems. Through close collaboration with OEMs, system integrators, and test equipment manufacturers, the company is leveraging its UltraCMO...
In this interview with Semicon Leaders Asia, Olivier Blachier, President, Materials Solutions, and SVP, Chief Innovation Officer at Entegris, shares insights into how strategic collaboration across the lithography ecosystem is accelerating the adoption of next-generation EUV technologies. He highlights the importance of Metal Oxide Resists, ultra-high-purity materials handling, a...
In this interview with Semicon Leaders Asia, Mr. Kosuke Inoue, Vice Sales General Manager at Asahi Kasei, outlines how the rapid growth of AI and high-performance computing is reshaping semiconductor packaging requirements and driving demand for advanced materials solutions. He highlights the company’s strategy to support next-generation package architectures through innovations in PSPI...
In this interview with Semicon Leaders Asia, Dominic Rizzo, Governing Board Chair, Pavana, and CEO, ZeroRISC, outlines how Pavana is fostering a more accessible and collaborative semiconductor ecosystem through its open-source silicon distribution model. He also shares insights into the growing importance of post-quantum cryptography and how secure, standards-based silicon soluti...
Nordic Semiconductor (OSE: NOD), a global leader in low-power wireless connectivity solutions, brings AI-assisted development to all parts of the IoT device lifecycle. Nordic's complete chip-to-cloud solution is the first in wireless IoT to enable AI-assisted workflows across every stage - from the prototype to the deployed fleet. For developers, Nordic's AI capabilities deliver three concrete be...
In this interview with Semicon Leaders Asia, Adam J Morgan, Co-founder, CEO, & Technical Lead for Packaging Design at NoMIS Power, highlights how the company is positioning its high-voltage SiC portfolio at the centre of next-generation HVDC and grid modernisation initiatives. Through participation in the ARPA-E DC-GRIDS programme and collaboration with leading industry and researc...
In this interview with Semicon Leaders Asia, Sean Dougherty, Vice President of Worldwide Sales at Everspin Technologies, discusses how advanced Toggle MRAM technology is enabling resilient, high-performance memory solutions for next-generation defense and aerospace applications while strengthening trusted domestic semiconductor manufacturing capabilities What does this agreement repr...
In this interview with Semicon Leaders Asia, Eugene Zetserov highlights how POLYN’s NASP technology is redefining edge intelligence by embedding AI directly into sensor-level silicon, eliminating the need for conventional digital processing overhead. By enabling ultra-low power consumption and microsecond-level response times, it unlocks new possibilities for alwa...
Acquisition accelerates Ecolab’s sales growth by significantly expanding its Global High-Tech growth engine, creating an end-to-end fluid management and cooling platform for AI data centers Ecolab announced today that it has entered into a definitive agreement to acquire CoolIT Systems, a high-growth, high-margin leader in liquid cooling technology for next-gen AI data cen...
NOR or NAND Flash? License AND! Arasan announces xSPI NOR AND eMMC NAND Combo PHY IP integrated seamlessly with its xSPI + eMMC Combo Controller IP Arasan Chip Systems, a leading provider of semiconductor IP for mobile and automobile SoCs, announced the immediate availability of its xSPI + eMMC Combo PHY IP. This IP integrates both xSPI and eMMC 5.1 PHY into a single unified solution...
Lam Research Corp. (Nasdaq: LRCX), a leader in semiconductor fabrication equipment and services and CEA-Leti, a research institute pioneering micro- and nanotechnologies, announced a new multi-year agreement to advance the development of next-generation Specialty Technology devices, including micro-electromechanical systems (MEMS), 3D imaging and sensors, power management and radio frequency...
Transaction strengthens QCi's technology roadmap and advances QCi toward becoming a vertically integrated, domestic provider of photonics and quantum platforms Quantum Computing Inc. ("QCi" or the "Company") (Nasdaq: QUBT), an innovative, quantum optics and integrated photonics technology company, announced the completion of acquiring Luminar Semiconductor, Inc. ("LSI"), ...