LG Uplus has entered into a partnership with AI semiconductor firm FuriosaAI to jointly develop an enterprise-focused “sovereign AI appliance” designed for secure, on-premises deployment. The companies signed a memorandum of understanding for AI infrastructure cooperation during Mobile World Congress 2026 in Barcelona. The agreement was attended by LG Uplus Chief Technology Officer Le...
Nordic Semiconductor, a global leader in low-power wireless connectivity solutions, unveils its new entry-level, ultra-low-power Bluetooth® Low Energy (LE) Systems-on-Chip (SoCs) – the nRF54LS05A and nRF54LS05B. Both can serve as the main wireless SoC in single-chip systems, or operate as Bluetooth LE companion devices in multi-chip systems, benefiting from Nordic's market-leading B...
GigaDevice, a leading semiconductor company specializing in Flash memory, 32-bit microcontrollers (MCUs), sensors, and analog products, announced its participation at Embedded World 2026 (Hall 5, Booth 5-129), with the strong presence at the show demonstrating the company’s commitment to the global market and the strategic emphasis that it has placed on the EMEA region, r...
Wolfspeed, Inc., a global leader in silicon carbide (SiC) technology, announced the industry's first commercially available 10 kV SiC power MOSFET. This milestone marks a defining moment in the industry — unlocking architectural freedom, delivering unprecedented system durability, and advancing access to reliable and sustainable power for the world's most demanding applications. This groundb...
Qualinx, the European semiconductor company redefining ultra-low-power connectivity, announced plans to showcase its market-ready 1 mW QLX3Gx Series GNSS chip with its dynamic reconfigurable architecture, along with a Developer Evaluation Kit (EVK), at Embedded World 2026 from 10-12 March in Nuremberg. The QLX3Gx EVK enables OEMs to directly validate Qualinx’s power-to-performance ...
Mouser Electronics, Inc., the authorized global distributor with the newest semiconductors and electronic components, proudly announces that Jaime Plank, Supplier Management Director, was named 2025 Strategic Partner of the Year by ODU, a valued partner and leading manufacturer of connectivity solutions. Additionally, April Kilman, Supplier Specialist, was named ODU's Supplier Manager of the ...
BrainChip Holdings Ltd (ASX: BRN, OTCQX: BRCHF, ADR: BCHPY), the world leader in ultra-low power, fully digital, event-based neuromorphic AI, announced that Nex Novus d.o.o., Neuromorphyx™, has selected the Akida™ AKD1500 co-processor for evaluation and integration in its Vision NeuroNode™ edge-AI device. This strategic engagement and partnership agreement expands BrainChip&rsqu...
Qnity Electronics, Inc. (“Qnity”) (NYSE: Q) announced the acquisition of a new facility in Taiwan to accelerate capacity and support continued customer demand across the global semiconductor industry. The $61.5 million advanced semiconductor research and manufacturing facility marks a significant investment in Qnity’s growth to keep pace with customer demand. The new facility wi...
Ambiq Micro, Inc. ("Ambiq®"), a leader in ultra-low-power semiconductor solutions for edge AI, revealed new technical details of its upcoming Atomiq™ SoC. Built on Ambiq's newly designed 12nm SPOT® platform using the TSMC N12e® process, Atomiq introduces a new Ultra-Low-Power (ULP) mode engineered to operate as low as 300mV— the lowest operating voltage in Ambiq's history. ...
As the global electronics manufacturing sector faces the dual challenges of capacity volatility and geoeconomic supply fragmentation, YY-IC, a leading digital ecosystem for electronic component procurement and risk management, announced the formal integration of the ISO 9001 Quality Management System into its global operations. According to YY-IC Supply Chain Intelligence Data...
Nordic Semiconductor, a global leader in low-power wireless connectivity solutions, announces a major expansion of its ultra-low-power cellular IoT products and technologies designed to deliver secure, global connectivity as networks and satellite NTN evolve. "Nordic is building the next era of cellular IoT, and we are expanding our portfolio to ...
Magnachip Semiconductor Corporation (NYSE: MX, “Magnachip”) announced the launch of its new 7th-generation 24V MXT LV MOSFET1 specifically designed for battery protection circuits in next-generation tri-fold smartphones, strengthening its presence in the premium foldable smartphone market. The product is now in mass production and is currently being supplied to a major global smar...
Semtech Corporation (Nasdaq: SMTC), a leading provider of high-performance semiconductor, Internet of Things (IoT) systems and cloud connectivity service solutions, announced a definitive agreement with Trident IoT that positions Semtech’s LoRa Plus™ platform as the connectivity foundation for next-generation multi-protocol smart home and security solutions. With this agreeme...
Toshiba Electronic Devices & Storage Corporation ("Toshiba") has launched four voltage-driven photorelays, “TLP3407SRB,” “TLP3412SRB,“ ”TLP3412SRHB,“ and “TLP3412SRLB” housed in the small S-VSON4T package. The new photorelays deliver a maximum operating temperature rating of 135°C for equipment that operates at high temperatures. Volume ...
Airspan Networks Holdings LLC (“Airspan”), a leading global provider of wireless network solutions, announced the launch of AirUnity Small Cells, a next-generation small cell portfolio designed to help mobile network operators (MNOs) and enterprises expand 4G and 5G coverage and capacity through targeted deployments that support scalable network densification across diverse indoor and ...
Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, announced that its ADAS automotive system-on-chip (SoC), R-Car V4H, has been selected for the TSS(LSS) control unit used in Toyota Motor Corporation’s new RAV4 model, which debuted in December 2025. The control unit is supplied by Denso Corporation. Engineered for advanced ADAS (Advanced Drive...
The Chemours Company (Chemours) (NYSE: CC), a global chemistry company, announced that Gerardo Familiar, President of the company's APM business, has been appointed to the SEMI North America Advisory Board (NAAB). SEMI is a global industry association serving thousands of member companies across the semiconductor and electronics design and manufacturing supply chain. The SEMI N...
SambaNova introduced their SN50 AI chip, which boasts a max speed that’s 5X faster than competitive chips. The company also announced a planned collaboration with Intel to deliver high‑performance, cost‑efficient AI inference solutions, and more than $350M in investment from new and existing investors. Positioned as the most efficient chip for agentic AI, the SN50 chip offers ...
Apple® announced a significant expansion of factory operations in Houston, bringing the future production of Mac mini® to the U.S. for the first time. The company will also expand advanced AI server manufacturing at the factory and provide hands-on training at its new Advanced Manufacturing Center beginning later this year. Altogether, Apple’s Houston operations will create thousands...
Fractilia, the industry leader in high-accuracy stochastics metrology and control, announced that its FAME 300™ system has been adopted for production use by a top-five semiconductor device maker, marking the first time an in-line stochastics control solution has been fully integrated into a modern manufacturing environment. Fractilia confirmed that FAME 300 has been deployed as a fully aut...