• Wednesday | 29 July 2026
Mitsubishi Electric and Sony Semiconductor Form AI Vision Joint Venture for Smart Manufacturing

Mitsubishi Electric Corporation and Sony Semiconductor Solutions Corporation have signed a definitive agreement to establish a strategic partnership aimed at accelerating the automation and digital transformation of manufacturing operations through advanced AI-powered vision technologies. As part of the collaboration, the two companies will create a new joint venture, Advanced Vision Solutions Co...

23 Jul 2026 | Thursday | NEWS
Micro-Transfer Printing Advances Silicon Photonics Integration for Next-Generation AI Infrastructure

Silicon photonics has emerged as a promising technology for addressing bandwidth and latency bottlenecks of conventional electrical interconnects and therefore are being explored for future artificial intelligence infrastructure. However, heterogenous integration of multiple material systems remains a challenge. Now, researchers show how micro-transfer printing can enable highly versatile heteroge...

21 Jul 2026 | Tuesday | NEWS
Tata Electronics Bets on Mature Semiconductor Nodes to Build India's First Commercial Chip Fab

Tata Electronics is focusing on mature semiconductor process technologies as it prepares to establish India's first commercial wafer fabrication facility, adopting a phased approach aimed at building a sustainable domestic chip manufacturing ecosystem rather than competing immediately in leading-edge production. The company's fabrication plant at Dholera, Gujarat, will initially manufacture chips...

20 Jul 2026 | Monday | NEWS
Mitsubishi Electric, Rohm and Toshiba Target September Deal to Merge Power Semiconductor Businesses

Mitsubishi Electric is aiming to reach an agreement by September to combine its power semiconductor business with those of Rohm and Toshiba, as the three Japanese companies seek to strengthen their competitiveness in the rapidly expanding global market for power chips. The proposed integration would bring together three of Japan's leading power semiconductor manufacturers, creating one of the wor...

20 Jul 2026 | Monday | NEWS
Penguin Solutions Closes US$750 Million Convertible Notes Offering to Accelerate AI Infrastructure Growth

Penguin Solutions, Inc., the AI Factory Platform Company (“Penguin,” “we” or the “Company”) (Nasdaq: PENG), announced that it has closed its previously announced private offering of $750.0 million aggregate principal amount of 0.00% convertible senior notes due 2031 (the “Notes”) to persons reasonably believed to be qualified institutional buyers as ...

20 Jul 2026 | Monday | NEWS
Researchers Develop Solvent-Based Method to Improve Organic Semiconductor Doping

Organic semiconductors are paving the way for a new generation of lightweight, flexible electronics, including bendable displays, printable circuits, wearable sensors, and devices that harvest energy from their surroundings. A key factor behind the performance of these technologies is doping—a process by which molecules are introduced into a semiconductor to control the number of charge carr...

13 Jul 2026 | Monday | NEWS
Samsung Begins Mass Production of PCIe 6.0 PM1763 Enterprise SSD for AI Servers and High-Performance Computing

Samsung Electronics Co., Ltd., a global leader in advanced memory technology,  announced mass production of PM1763, the company’s PCIe® 6.0-based enterprise solid-state drive (SSD) optimised for next-generation AI and HPC server environments. As the volume of data required for AI training and inference continues to grow rapidly, enterprise SSDs (eSSDs) that deliver data quickly and...

9 Jul 2026 | Thursday | NEWS
Mouser Electronics Wins HARTING Global High Service Distributor of the Year Award for Second Consecutive Year

Mouser Electronics, Inc., the authorised global distributor with the newest electronic components and industrial automation products, announced it has received the prestigious Global High Service Distributor of the Year Award from HARTING. Mouser also received the Distinguished Award for New Product Sales Growth. This is the second consecutive year that Mouser has received these prestigious d...

3 Jul 2026 | Friday | NEWS
LG Innotek Targets AI Semiconductor Boom with High-Value Substrate Portfolio Expansion

LG Innotek, renowned for its optical solution business and leadership in high-performance camera modules, is quickly establishing itself as a key player in package solutions, including high-value-added semiconductor substrates. Backed by a combination of structural growth drivers—including the rollout of 5G networks, trend toward higher-performing components in premium smartphones, ongoing ...

1 Jul 2026 | Wednesday | NEWS
Toshiba Launches 80V Power MOSFET to Boost AI Data Centre Power Supply Efficiency

Toshiba Electronic Devices & Storage Corporation ("Toshiba") has launched “TPM1R408RH,” an 80V N-channel power MOSFET fabricated using U-MOS11-H, Toshiba’s latest-generation process[1]. The MOSFET targets applications such as switched-mode power supplies for industrial equipment used in AI data centres and communications base stations. Shipments start. The ongoing expan...

1 Jul 2026 | Wednesday | NEWS
Samsung Unveils Industry’s First UFS 5.0 Storage, Advancing On-Device AI Performance

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, announced that, for the first time in the industry, it has developed the industry's fastest Universal Flash Storage (UFS) 5.0 solution, which will help enable seamless and highly efficient AI services on future mobile devices. The milestone sets a new benchmark for the next-generation mobile memory market as the enhanc...

24 Jun 2026 | Wednesday | NEWS
Qnity Launches Advanced Packaging Innovation Hub to Accelerate AI and Next-Generation Semiconductor Growth

Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, announced the launch of its Advanced Packaging Innovation Hub, underscoring advanced packaging as a strategic growth driver and innovation priority for the company. The new online platform showcases Qnity’s breadth of material and technology solutions desi...

24 Jun 2026 | Wednesday | NEWS
Magnachip Launches 6th-Generation 600V SJ MOSFETs to Address Rising AI Server and EV Charging Demand

Magnachip Semiconductor Corporation (NYSE: MX, “Magnachip”) announced the introduction of two new 6th-generation 600V Super Junction (SJ) MOSFETs designed to meet the growing performance and efficiency requirements of AI servers, EV charging systems and industrial power applications. The new products feature low RDS(ON) values of 36mΩ and 37mΩ, helping reduce conduction lo...

24 Jun 2026 | Wednesday | NEWS
Torex Launches Zero-Current Load Switch ICs for Ultra-Low-Power Applications

Torex Semiconductor Ltd. (TOKYO Prime: 6616) has developed the XC8115/XC8116 Series, multifunction load-switch ICs that achieve 0 µA current consumption. Featuring ultra-low power consumption, space-saving operation up to 105°C, and functions required for power sequence control, these multifunction load switch ICs are easy to use across a wide range of applications, including industrial ...

23 Jun 2026 | Tuesday | NEWS
Qnity Unveils Advanced Packaging Materials for AI and High-Performance Computing Chips

Qnity Electronics, Inc. (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, introduced enhanced advanced packaging material solutions for organic interposer applications: Intervia™ 8540HSP multi-role copper and Cyclotene™ DF6800M dry film photo-imageable dielectric. The material innovations are designed to support advanced interconnect formation, redi...

11 Jun 2026 | Thursday | NEWS
Mr. Kosuke Inoue of Asahi Kasei on Advancing Materials Innovation for AI-Driven Semiconductor Packaging

In this interview with Semicon Leaders Asia, Mr. Kosuke Inoue, Vice Sales General Manager at Asahi Kasei, outlines how the rapid growth of AI and high-performance computing is reshaping semiconductor packaging requirements and driving demand for advanced materials solutions. He highlights the company’s strategy to support next-generation package architectures through innovations in PSPI...

8 Jun 2026 | Monday | Interaction
Wiwynn Showcases Rack-Scale AI Infrastructure and Next-Generation Data Centre Technologies at Computex 2026

Wiwynn (6669), an innovative cloud IT infrastructure provider for data centres, today announced to showcase its vision of next-generation data centre designs at Computex 2026 (Booth #J0106, TaiNEX1). The exhibition spans cutting-edge rack-scale AI servers, developed with Wistron, breakthrough cooling technologies, optical scale-up designs, and high-voltage DC (HVDC) power delivery architectures. ...

27 May 2026 | Wednesday | NEWS
Toshiba Electronic Devices & Storage Corporation Launches TXZ+™ Entry-Class M4H Microcontrollers for Consumer and Industrial System Control

Toshiba Electronic Devices & Storage Corporation (“Toshiba”) has announced the TXZ+™ Family Entry‑Class M4H Group, standard microcontrollers[1] featuring an Arm® Cortex®‑M4 core with a floating-point unit (FPU). The new microcontrollers are designed for application in small‑scale system control of consumer products, such as air conditioners a...

27 May 2026 | Wednesday | NEWS
King Yuan Electronics Corp Invests S$100 Million in Singapore Semiconductor Testing Facility

Taiwanese semiconductor testing company King Yuan Electronics Corp (KYEC) is investing S$100 million in a new semiconductor testing facility in Singapore as part of its broader international expansion strategy. The project is expected to create more than 300 jobs across engineering, operations and management roles, strengthening Singapore’s position within the global semicond...

25 May 2026 | Monday | NEWS
NoMIS Power Joins $2.5M US Grid Modernisation Project to Advance SiC HVDC Power Technology

NoMIS Power Corporation, a leader in advanced Silicon Carbide (SiC) power semiconductor technology, announced its participation as an industry partner in a three-year, $2.5 million project led by Michigan State University (PI: Dr Omid Beik) to develop high-voltage SiC-based Neutral Point Clamped Power Electronics Building Blocks (NPC-PEBBs) as vendor-agnostic, plug-and-play sub...

18 May 2026 | Monday | NEWS

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