• Friday | 31 July 2026
Renesas Electronics Corporation Unveils 3nm TCAM for Automotive and High-Speed Networks

Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, announced a configurable ternary content-addressable memory (TCAM) built on a 3nm FinFET process. The new TCAM simultaneously delivers higher density, lower power and strengthened functional safety, making it suitable for automotive applications. Renesas presented the results at the International So...

20 Feb 2026 | Friday | NEWS
Aitech and Teledyne e2v Semiconductors Partner to Advance Space-Grade AI Computing

Aitech and Teledyne e2v Semiconductors are proud to highlight their continued collaboration in advancing space-grade computing. Through their ongoing partnership, Teledyne e2v’s high-reliability semiconductors are being integrated into Aitech’s SP1, a radiation-tolerant 3U SpaceVPX single-board computer (SBC). Designed for deployment in LEO, GEO, lunar, and deep space missions, t...

19 Feb 2026 | Thursday | NEWS
Lattice Semiconductor Launches Cyber Resilience Kit to Strengthen Industrial Edge Security

Lattice Semiconductor (NASDAQ: LSCC), the low power programmable leader, announced a Cyber Resilience Reference Kit designed to help industrial and edge device manufacturers accelerate secure system design, developed in collaboration with EXOR International and TrustiPhi. Built on the Lattice MachXO3D™ secure control FPGA, EXOR International’s industrial edge platform, and TrustiP...

19 Feb 2026 | Thursday | NEWS
Keysight Technologies, Inc. Launches 3D Interconnect Designer to Accelerate AI Chip and Chiplet Development

Keysight Technologies, Inc. (NYSE: KEYS) introduced 3D Interconnect Designer, a new addition to its Electronic Design Automation (EDA) portfolio. The solution addresses the mounting complexity of designing 3D interconnects for high-chiplet and 3DIC advanced packages used in AI infrastructure and data center applications. As chiplet architectures are increasingly adopted, engineers face compl...

19 Feb 2026 | Thursday | NEWS
Efinix, Inc. Appoints Semiconductor Veteran BC Ooi to Board to Support Edge AI Growth

Efinix®, Inc., the FPGA pioneer accelerating edge AI innovation, announced that Boon Chye (BC) Ooi has joined its Board of Directors. Ooi, a semiconductor industry veteran with more than 45 years of operational leadership experience, will provide strategic guidance as Efinix scales its business and expands its market presence in FPGA and edge AI applications. Ooi brings unparalleled expertise...

19 Feb 2026 | Thursday | NEWS
ChipAgents Raises $50 Million to Scale AI Platform for Semiconductor Design

ChipAgents, the category leader for Agentic AI platforms in the semiconductor design industry, announced it has closed an oversubscribed $50 million Series A1 funding round, bringing total capital raised to $74 million. The round was led by Matter Venture Partners, a TSMC-backed HardTech VC firm, with participation from existing investors Bessemer Venture Partners, Micron, MediaTek, and Ericsson. ...

19 Feb 2026 | Thursday | NEWS
Lam Research Corp. Opens New Boise Office to Strengthen U.S. Memory Chip Manufacturing

 Lam Research Corp. (NASDAQ: LRCX) commemorated the opening of its new office in Boise, Idaho, joined by U.S. Senator Jim Risch, representatives of Micron Technology, Inc. and other distinguished local government, community, and academic leaders. The new office will initially support approximately 150 Lam personnel from the greater Boise area focused on collaborative research, devel...

19 Feb 2026 | Thursday | NEWS
Ambiq Micro, Inc. Launches Open-Source AI Development Kit to Accelerate Edge Audio Innovation

Ambiq Micro, Inc. (“Ambiq®”)— Ambiq, a leader in ultra-low-power semiconductor solutions, announced soundKIT, its fourth open-source AI Development Kit (ADK), designed to accelerate the adoption of always-on, real-time, on-device audio and speech intelligence for power-constrained edge devices. Built for Ambiq’s ultra-low-power system-on-chips (SoCs), soundKIT ena...

18 Feb 2026 | Wednesday | NEWS
Microchip Technology Sees Demand Recovery as Semiconductor Orders Exceed Shipments

Microchip Technology has reported signs of strengthening demand as semiconductor distribution channels return to more balanced levels, enabling the company to prioritise debt reduction and improve its financial position. According to company leadership, customer orders have begun to exceed shipments, signalling a gradual recovery in market activity and renewed customer confidence. The company exp...

17 Feb 2026 | Tuesday | NEWS
Texas Instruments Launches New Automotive Chips to Support Autonomous Driving and Vehicle Safety

Texas Instruments has introduced a new range of automotive semiconductor solutions designed to enhance vehicle safety and enable higher levels of driving automation. The latest portfolio reflects the company’s ongoing efforts to support the automotive industry’s transition towards more intelligent, connected and software-defined vehicles. A key component of the annou...

17 Feb 2026 | Tuesday | NEWS
SkyWater Technology Appoints Christine Dunbar to Lead Sales and Drive Foundry Expansion

SkyWater Technology (NASDAQ: SKYT), the largest exclusively U.S.-based pure-play semiconductor foundry, announced the appointment of Christine Dunbar as senior vice president of sales and solutions engineering, reporting directly to President and COO John Sakamoto. In her role, Dunbar will focus on accelerating customer acquisition and scaling growth across the company’s core platforms....

17 Feb 2026 | Tuesday | NEWS
15 Major Tech Companies Partner to Strengthen Global Trust in AI and Cloud Technologies

Munich Security Conference, 15 companies from Africa, Asia, Europe, and North America announced the launch of the Trusted Tech Alliance (TTA), a group of likeminded global technology providers coming together to work across borders, and based on a shared set of principles for a trusted technology stack – from connectivity, cloud infrastructure, and semiconductors to software and AI. &nb...

17 Feb 2026 | Tuesday | NEWS
Dr. Bruce Gnade Elected to National Academy of Engineering for Contributions to Semiconductor and Electronic Materials Innovation

Dr. Bruce Gnade, professor emeritus of materials science and engineering and director of workforce development at the North Texas Semiconductor Institute at The University of Texas at Dallas, was elected Feb. 10 as a member of the National Academy of Engineering (NAE), one of the highest professional distinctions accorded to an engineer. Gnade is one of 158 members, ...

16 Feb 2026 | Monday | NEWS
EPC and Renesas Form Strategic Licensing Alliance to Accelerate Global Adoption of GaN Power Technologies

Efficient Power Conversion (EPC), the world leader in enhancement-mode gallium nitride (eGaN®) power devices, today announced a comprehensive licensing agreement with Renesas Electronics Corporation, a premier global supplier of advanced semiconductor solutions and high-voltage GaN transistors. Under the agreement, Renesas will gain access to EPC’s proven low-voltage eGaN technology and...

16 Feb 2026 | Monday | NEWS
Trio-Tech International Reports 82% Revenue Growth in Q2 FY2026 Driven by AI Chip and EV Semiconductor Testing Demand

Trio-Tech International (NYSE MKT: TRT), a comprehensive provider of semiconductor back-end solutions and a global value-added supplier of electronic equipment, announced financial results for its fiscal second quarter ended December 31, 2025. The Company reported 82% year-over-year revenue growth, driven primarily by strong demand for advanced semiconductor testing services supporting AI compute ...

16 Feb 2026 | Monday | NEWS
VORAGO and wolfSSL Partner to Secure the Next Generation of Satellites

At SmallSat Symposium 2026, VORAGO Technologies, a radiation-hardened and radiation-tolerant chip provider for space applications, announced a software partnership with wolfSSL, a company specialising in embedded cryptography for secure systems, successfully for the last 20 years. This unique partnership delivers radiation-hardened chips with built-in, standards-based cryptographic secur...

13 Feb 2026 | Friday | NEWS
I/ONX Joins UNLV Program to Support Semiconductor Education

I/ONX High Performance Compute (HPC) has been selected to participate in a series of classes and training workshops at the University of Nevada, Las Vegas’ (UNLV) College of Engineering. I/ONX has joined the AI-driven, Career Inspiring Experiential Program for Semiconductor Education (ACIES) program as an industry partner, and Chief Executive Officer Justyn Hornor is leading the discussions...

13 Feb 2026 | Friday | NEWS
Marvell Completes Acquisition of XConn

Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, announced that it has completed its previously announced acquisition of XConn Technologies (“XConn”), a provider of advanced PCIe and CXL switching silicon. The acquisition expands Marvell’s switching portfolio with XConn’s PCIe and CXL products and strengthens Marvell’s...

12 Feb 2026 | Thursday | NEWS
Amkor Technology Reports Fourth Quarter and Full Year 2025 Results

Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, announced financial results for the fourth quarter and full year ended December 31, 2025. Fourth Quarter 2025 Highlights: Fourth quarter net sales $1.89 billion, up 16% year-on-year Net income $172 million, earnings per diluted share $0.69 Full Year 2025 Highlights: Net sales $6.71 bi...

11 Feb 2026 | Wednesday | NEWS
Teledyne Begins Production of Infrared Sensors for SDA Tranche 3

Teledyne Technologies Incorporated (NYSE:TDY), a global leader in advanced imaging and sensor solutions, is pleased to announce the start of production on multiple awards to deliver state-of-the-art infrared Focal Plane Modules (FPMs) in support of the Space Development Agency’s (SDA) Tracking Layer Tranche 3 (TRKT3) program. These sensors will support SDA satellites in low Earth orbit (LEO)...

11 Feb 2026 | Wednesday | NEWS

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