Ezurio, a global leader in connectivity, proudly announces the release and immediate availability of the BL54L15μ Series, a breakthrough Bluetooth® Low Energy (LE) module series designed to deliver big performance in an ultra-compact footprint. Built on Nordic Semiconductor's nRF54L15 SoC and featuring a chip antenna or trace pad, the BL54L15μ is the most compact nRF54L-based solution ...
NEO Semiconductor, a leading developer of breakthrough memory technologies, introduced the world's first Extreme High Bandwidth Memory (X-HBM) architecture for AI chips. Built to meet the growing demands of generative AI and high-performance computing, X-HBM delivers unmatched performance with a 32K-bit data bus and potentially 512 Gbit per die, dramatically surpassing the limitations of tra...
In a world increasingly shaped by intelligent devices that connect, sense, and perceive our surroundings, Ceva, Inc., the leading licensor of silicon and software IP for the Smart Edge, today announced it has surpassed 20 billion Ceva-powered devices shipped globally. This milestone not only cements Ceva's legacy as a foundational technology provider of the mobile and IoT eras, but sets the...
Arasan Chip Systems, a leading provider of semiconductor IP for mobile and automobile SoCs, announced the immediate availability of the industry's first MIPI SWI3S Manager IP and SWI3S Peripheral IP Cores. The SWI3S IP gate count is kept extremely low, targeting applications like the Microphones while also ensuring low latency. Arasan's SWI3S IP joins Arasan's extensive MIPI IP portfolio ...
As demand accelerates for intelligent, video-centric devices across consumer and industrial markets, ALi Corporation and Ceva, Inc. announced a strategic licensing partnership to integrate Ceva's advanced NeuPro-Nano and NeuPro-M Neural Processing Units (NPUs) into ALi's next-generation Video Display Sub-System (VDSS) platform. This collaboration combines ALi's expertise in multimedia SoCs ...
DuPont de Nemours, Inc.("DuPont") and Qnity Electronics, Inc. ("Qnity") announced today Qnity's intention to offer, subject to market and customary conditions, (i) $1.5 billion aggregate principal amount of senior secured notes due 2032 (the "Secured Notes") and (ii) $1.0 billion aggregate principal amount of senior notes due 2033 (the "Unsecured Notes" and, together with the Secured Notes, the ...
Normal Computing announces the successful tape-out of CN101, the world's first thermodynamic computing chip. This engineering milestone represents a key step toward validating Normal's Carnot architecture, purpose-built to accelerate computational tasks by harnessing the intrinsic dynamics of physical systems and achieving up to 1000× energy consumption efficiency on targeted AI and scient...
Modalix™, a second-generation Machine Learning System on a Chip (MLSoC™) purpose built to lead the Physical AI industry, delivers industry-leading performance and accuracy without sacrificing power—supporting LLMs, transformers, CNNs, and GenAI workloads under 10 watts. Its flexible, Arm-based architecture with a native GenAI stack enables real-time perception, decision-making,...
PI (Physik Instrumente), a global leader in precision motion and positioning solutions, offers standard and custom air bearing linear slides. Based on decades of experience from PI's USA engineering and manufacturing teams, these air bearings are designed for applications requiring ultra-smooth, zero stick-slip linear motion and sub-micron straightness and flatness. Frictionless Performa...
Axcelis Technologies, Inc., a leading supplier of enabling ion implantation solutions for the semiconductor industry, announced a Joint Development Program (JDP) with GE Aerospace focused on the development of production-worthy 6.5 to 10kV superjunction power devices. Processes will be developed on Axcelis' Purion XEmax™ high energy implanter, which provides the industry's highest beam cur...
Pixelworks, Inc., a leading provider of visual processing solutions, announced that the newly launched realme P4 5G and P4 Pro 5G smartphones incorporate Pixelworks' X7 Gen 2 visual processor. The realme P4 series smartphones are the first models in the P series to integrate a dedicated visual processor solution aimed at setting a new benchmark for mid-range international market segment. Powered...
Hyundai Mobis has obtained the highest grade of ISO 26262 certification, an international standard for functional safety, for its entire vehicle semiconductor R&D process. It is noted that this rigorous certification was obtained not for specific products, but for the entire process ranging from semiconductor design to quality verification. This certification means that when Hyundai M...
SK hynix Inc. (or 'the company', www.skhynix.com) announced that it has completed development of its 321-layer 2Tb QLC NAND flash product and has begun mass production. This achievement marks the world's first implementation of more than 300 layers using QLC technology, setting a new benchmark in NAND density. The company plans to release the product in the first half of next year foll...
As AI, HPC, and 5G drive semiconductor innovation, advanced packaging has become the next strategic focus. Yole Group projects the market to exceed USD 50 billion by 2025, with fan-out panel-level packaging (FOPLP) growing more than 15% annually. E&R Engineering (TPE: 8027) will present its latest laser and plasma solutions at SEMICON Taiwan 2025, covering FOPLP, Through-Silicon Via (T...
Semiconductor and electronics supply chains are undergoing a major transformation, driven by the rapid growth of artificial intelligence (AI), changing market leadership, and global supply chain relocation, according to DIGITIMES. DIGITIMES vice president Eric Huang highlighted the shift in global industry power before and after the generative AI boom. In 2018, five technology companies ranked ...
PCBAIR, a leading provider of high-precision PCBs, has supported rapid growth in industries such as optical communications, automotive electronics and high-end medical devices by delivering large-scale, precision PCB manufacturing. These demanding sectors require more compact designs, shorter signal paths and enhanced thermal management to meet ever-increasing performance and reliability standar...
ROHM Co., Ltd. has announced that its ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry's lowest operating circuit current (*1). This IC is optimized to be applied as a measurement-sensing amplifier in size-constrained applications such as handheld measurement instruments, wearable devices, and indoor motion detectors. Figures: Product features: https://cdn.kyod...
MetaOptics Ltd (the "Company", together with its subsidiary, the "Group"), a cutting-edge vertically integrated designer and manufacturer of meta optics components and products headquartered in Singapore, has attracted strong support for its initial public offering (the "IPO") and listing of the Company (the "Listing") on the Catalist Board of the Singapore Exchange Securities Trading Limit...
PI (Physik Instrumente), a global leader in precision motion control and nano-positioning technologies, offers its Nanopositioning & Micropositioning Essentials portfolio, delivering core components with reduced lead times and volume discounts tailored for OEMs in research, automation, and advanced manufacturing. This curated Essentials product line features high-precision building blo...
Valens Semiconductor announced that Samsung is supporting the MIPI A-PHY standard for high-speed sensor connectivity and is partnering with Valens Semiconductor to develop the next generation of MIPI A-PHY products, in response to strong market demand from global OEMs. Valens and Samsung have a long history of collaboration. Samsung was among the earlier investors in Valens, and the two co...